Qualcomm–Tata Pact to Manufacture Automotive Chips at Assam OSAT Plant

Guwahati: In a significant boost to Assam’s developing semiconductor landscape, Qualcomm Technologies, Inc. has entered into a manufacturing partnership with Tata Electronics to produce automotive modules in India.

Under the agreement, Tata Electronics will become part of Qualcomm’s global module manufacturing ecosystem, supporting rising international demand for modular automotive solutions. The modules will be produced at Tata Electronics’ upcoming semiconductor assembly and test (OSAT) facility in Jagiroad, aligning with the Government of India’s ‘Make in India’ vision.

The collaboration will facilitate domestic manufacturing of advanced automotive technologies, including digital cockpit systems, infotainment platforms, connectivity solutions, and intelligent vehicle electronics. The move is expected to serve both Indian and global automobile manufacturers while enhancing supply chain resilience and regional diversification.

Qualcomm’s automotive modules integrate its Snapdragon Digital Chassis system-on-chip with essential system components into ready-to-deploy units, enabling automakers to accelerate product development as the industry transitions towards software-defined vehicles. 

Nakul Duggal, Executive Vice President and Group General Manager for Automotive, Industrial and Embedded IoT, and Robotics at Qualcomm Technologies, said expanding production capacity in strategic markets is critical as the sector shifts towards module-based architectures. He added that Tata Electronics’ manufacturing capabilities and technological expertise make it a strong partner in strengthening India’s position within the global semiconductor and automotive industries.

Savi Soin, senior vice president and president of Qualcomm India, noted that local manufacturing would enhance operational flexibility and help the company better serve original equipment manufacturers (OEMs). 

Dr. Randhir Thakur, Chief Executive Officer and Managing Director of Tata Electronics, described the partnership as a milestone in the company’s ambition to build a global high-technology manufacturing hub. He said the company would utilise its integrated systems packaging capabilities to deliver high-performance automotive solutions. 

The Jagiroad OSAT facility, being developed with an estimated investment of around $3 billion, will focus on packaging technologies such as wire bonding, flip chip, and integrated systems packaging. Industry experts believe the project could reinforce Assam’s role in the global semiconductor supply chain while generating substantial skilled employment in the region.

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